Engineering of thin film microstructure for the microelectronics industry
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Value
$1,697,818
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Prompt Contribution
$332,827
This project focuses on two products: 1) improving the durability of films used to protect masks during the lithography stage, and 2) increasing the detection performance of thin films for bolometer infrared photon detection.
Improving the performance of these films requires modifying their composition based on a thorough understanding of the links between the process, microstructure, and resulting properties. This involves understanding how the microstructure of the films evolves during the various stages of manufacture and during their use, and linking these aspects to their electrical, optical, and thermal performance. The microstructure of the films will be modulated by introducing dopants that are compatible with industrial constraints, which will also require optimization of the manufacturing parameters based on the relevant properties.
Major investments have recently been announced by Canada and the US to create autonomy from Asia in the microelectronic component supply chain. This research project will contribute to this effort while enabling the development of strategic materials for TD and promoting unique expertise based in Quebec and Canada.
Organisation (s)
