{"id":5618,"date":"2026-07-21T14:48:39","date_gmt":"2026-07-21T19:48:39","guid":{"rendered":"https:\/\/promptinnov.com\/?post_type=funded-project&#038;p=5618"},"modified":"2026-07-22T10:50:21","modified_gmt":"2026-07-22T15:50:21","slug":"ibm-canada-x-c2mi-x-udes","status":"publish","type":"funded-project","link":"https:\/\/promptinnov.com\/en\/funded-projects\/ibm-canada-x-c2mi-x-udes\/","title":{"rendered":"IBM Canada x C2MI x Universit\u00e9 de Sherbrooke"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">Heterogeneous Multi-Chip Integration for High-Performance Computing.<\/h2>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-28f84493 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:50%\"><section class=\"arrows-list aligndefault\"\n>\n\n  <ul>\n    \n        <li class=\"arrows-list__item arrows-list__item--black-blue\">\n          <div class=\"arrows-list__item__container\">\n            <p class=\"arrows-list__item__title\">Value<\/p>\n            <p class=\"arrows-list__item__txt\">$4,756,080<\/p>\n          <\/div>\n        <\/li>\n\n        \n        <li class=\"arrows-list__item arrows-list__item--black-blue\">\n          <div class=\"arrows-list__item__container\">\n            <p class=\"arrows-list__item__title\">Prompt Contribution<\/p>\n            <p class=\"arrows-list__item__txt\">$807,080<\/p>\n          <\/div>\n        <\/li>\n\n          <ul>\n<\/section>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\" style=\"flex-basis:50%\">\n<p>Advanced packaging technologies are crucial to the evolution of microelectronics, as they enhance performance through heterogeneous integration. Traditional methods no longer meet the demands of high-performance computing, AI, aerospace, and defense. Recent new solutions offer higher density and better energy efficiency to address these requirements, but they suffer from manufacturing complexities, reliability issues, and thermal management challenges. The project aims to specifically address these shortcomings by developing a new Fan-Out Wafer Level Package (FOWLP) process, called D4-FOWLP. This approach is based on the following \u201cD\u201d elements, which give it the name D4:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li>D1-Die-Last Assembly Scheme: Maximize yield by placing known-good dies (KGDs) on pre-qualified interposer sites.<\/li>\n\n\n\n<li>D2-Die-to-Reconstituted Wafer Bonding: Support complex chip architectures with multiple bridges and capacitors integrated into the package.<\/li>\n\n\n\n<li>D3-Drive-in Cooling System: Develop advanced cooling systems using MEMS manufacturing capabilities.<\/li>\n\n\n\n<li>D4-High-Density Lateral Interconnects: Use adaptive lithography and plasma etching techniques to create ultra-fine-pitch RDLs. Expected results include improvements in semiconductor density, thermal management, mechanical integrity, and manufacturability.<\/li>\n<\/ul>\n\n\n\n<p>The project will deliver a scalable, cost-effective, and thermally efficient solution, strengthening IBM\u2019s leadership and contributing to Canada\u2019s technology landscape. Industry partners will benefit from advanced packaging technologies that will enhance their products and processes. For Quebec, this means strengthening its critical position in the field of microelectronics and cutting-edge technologies. Such a position, especially in the context of \u201cNorth American reshoring,\u201d will significantly contribute to stimulating innovation within Technum Qu\u00e9bec and to Quebec\u2019s economy.<\/p>\n<\/div>\n<\/div>\n\n\n<section class=\"partners-carrousel aligndefault\" id=\"partners-carrousel-6a65c3c32bf44\">\n  <h2 class=\"partners-carrousel__title\">Organisation (s)<\/h2>\n<div class=\"swiper swiper-partners\">\n  <div class=\"swiper-wrapper\">\n            <a href=\"https:\/\/www.ibm.com\/ca-fr\" class=\"swiper-slide\" target=\"_blank\" rel=\"noopener\">\n          <img decoding=\"async\" width=\"920\" height=\"512\" src=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/02\/png-transparent-ibm-canada-head-office-building-maximo-computer-icons-ibm-z-ibm-angle-text-rectangle.png\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/02\/png-transparent-ibm-canada-head-office-building-maximo-computer-icons-ibm-z-ibm-angle-text-rectangle.png 920w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/02\/png-transparent-ibm-canada-head-office-building-maximo-computer-icons-ibm-z-ibm-angle-text-rectangle-300x167.png 300w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/02\/png-transparent-ibm-canada-head-office-building-maximo-computer-icons-ibm-z-ibm-angle-text-rectangle-768x427.png 768w\" sizes=\"(max-width: 920px) 100vw, 920px\" \/>        <\/a>\n                <a href=\"https:\/\/www.c2mi.ca\/\" class=\"swiper-slide\" target=\"_blank\" rel=\"noopener\">\n          <img decoding=\"async\" width=\"425\" height=\"200\" src=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/06\/c2mi-header-logo-en-01.png\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/06\/c2mi-header-logo-en-01.png 425w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/06\/c2mi-header-logo-en-01-300x141.png 300w\" sizes=\"(max-width: 425px) 100vw, 425px\" \/>        <\/a>\n                <a href=\"https:\/\/www.usherbrooke.ca\/\" class=\"swiper-slide\" target=\"_blank\" rel=\"noopener\">\n          <img decoding=\"async\" width=\"1280\" height=\"331\" src=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/01\/image-3.png\" class=\"attachment-post-thumbnail size-post-thumbnail wp-post-image\" alt=\"\" srcset=\"https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/01\/image-3.png 1280w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/01\/image-3-300x78.png 300w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/01\/image-3-1024x265.png 1024w, https:\/\/promptinnov.com\/wp-content\/uploads\/2025\/01\/image-3-768x199.png 768w\" sizes=\"(max-width: 1280px) 100vw, 1280px\" \/>        <\/a>\n          <\/div>\n  <div class=\"swiper-navigation\">\n    <div class=\"swiper-button-prev\"><\/div>\n    <div class=\"swiper-button-next\"><\/div>\n  <\/div>\n<\/div>\n<\/section>\n\n\n\n<p><\/p>\n","protected":false},"featured_media":4581,"template":"","funded-project-category":[166,212],"location":[152],"industry":[135],"class_list":["post-5618","funded-project","type-funded-project","status-publish","has-post-thumbnail","hentry","funded-project-category-2025-cohort","funded-project-category-microelectronics","location-montreal-en","industry-it-and-software"],"acf":[],"_links":{"self":[{"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/funded-project\/5618","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/funded-project"}],"about":[{"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/types\/funded-project"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/media\/4581"}],"wp:attachment":[{"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/media?parent=5618"}],"wp:term":[{"taxonomy":"funded-project-category","embeddable":true,"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/funded-project-category?post=5618"},{"taxonomy":"location","embeddable":true,"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/location?post=5618"},{"taxonomy":"industry","embeddable":true,"href":"https:\/\/promptinnov.com\/en\/wp-json\/wp\/v2\/industry?post=5618"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}